smd encapsulant
introduction
this series is two-component silicone encapsulant. s207 / s208 is resin type, while s209 / s210 is rubber type. with high refractive index, air tightness, low permeability for sulfur gas, resistance to reflow, this series is suitable for led smd packaging.
properties
|
product name |
f-s207 |
f-s208 |
f-s209 |
|
uncured properties |
|||
|
appearance |
a translucent
/ |
a translucent
/ |
a translucent
/ |
|
mixed viscosity mpa•s |
7000 |
5000 |
5000 |
|
cure condition °c/h |
80/1 150/3 |
80/1 150/3 |
80/1 150/3 |
|
固化后性能 |
|||
|
refractive index @25°c |
1.54 |
1.54 |
1.54 |
|
tg ℃ |
53 |
49 |
35 |
|
shore hardness |
45d |
35d |
85a |
|
transmittance @450nm % |
＞91 |
＞91 |
＞91 |
|
linear cte ppm/k |
220 |
220 |
225 |
